贴装讨论请附：封装清单摘要、是否有 BGA/QFN、回流曲线观察项（若已有）、以及未覆盖风险（潮湿敏感、翘曲等）。指南：/guides/assembly-smt-fields

English: Package summary, special parts, reflow notes, and open risks — no fabricated yield claims.